| 摘要 |
PROBLEM TO BE SOLVED: To evaluate requirements and conditions of the patterning process of a printed wiring board by flowing evaluation substrates additionally prepared to products when starting the line and then inspecting the reference pattern of the evaluation substrate. SOLUTION: The surface of the copper clad resin substrate of an evaluation substrate 10 is divided into a plurality of regions and the reference pattern corresponding to the shape and density of various wiring patterns to be patterned to the product is formed in the respective regions. As the reference patterns, the resist pattern 1a on the entire surface of the copper foil in the 1/2 areas of the regions A, F, H, base pattern 1b exposing the resin base, vertical pattern 2a and horizontal pattern 2b parallel to the 1/2 region of the regions B, J, vertical zig-zag pattern 3a in the region D and horizontal zig-zag pattern 3b in the regions C, E, G are formed. When the line is started, a plurality of evaluation substrates are inspected, the reference patterns are inspected immediately before the resist separating process and requirements and conditions of each process of the line can be evaluated depending on the inspection result. |
