| 摘要 |
PROBLEM TO BE SOLVED: To enhance work efficiency in mounting a bare chip to a substrate by wire bonding. SOLUTION: A plurality of pads 4 for a substrate are formed on a surface of a module substrate 2, and two recesses 6 are formed on both sides of the plurality of pads 4 for the substrate. These recesses 6 have a depth nearly equal to the thickness of bare chips 1 for a memory, and pads 3 for the chips are of substantially equal height with those of the pads 4 for the substrate, when the bare chips 1 for the memory are mounted on the bottom of the recesses 6, respectively. In this way, the pads 4 for the substrate are connected to the pads 3 for the chip, which are substantially flush with the pads 4 by means of bonding wires. |
