The proposal is for a stackable data substrate arrangement with at least one external connection running around the edge surfaces of the substrate component of the data substrate arrangement. In the substrate component there are two mutually parallel slots which extend from the edge surface into the substrate component to about the same extent as the external connection fitted between them so that a contact spike bendable perpendicularly to the main surfaces of the substrate component is formed through the region between the slots. This ensures tolerance compensation if several data substrate arrangements are stacked on one another. An electromagnetic screen between the stacked data substrate arrangements is also proposed.
