| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive material excellent in performances such as sensitivity, developability, curability and chemical resistance as a material useful to form a soldering resist film and insulating resin layers of various electronic parts. SOLUTION: The photosensitive material contains (A) a prepolymer obtained by reacting a reaction product of an epoxy compound (a) having two or more epoxy groups in one molecule, a compound (b) having one or more polymerizable unsaturated groups and one carboxyl group in one molecule and a compound (c) having two or more carboxyl groups in one molecule with a polybasic acid anhydride (d), (B) a photopolymerization initiator, (C) a reactive diluent and (D) a blocked isocyanate. |
