LAMINATE FOR MULTI-LAYER PRINTED CIRCUIT

摘要

A laminate for use as a surface laminate in a multi-layer printed circuit board. The laminate is comprised of a film substrate formed of a first polymeric material. At least one layer of a flash metal is applied to a first side of the film substrate. At least one layer of copper is disposed on the layer of flash metal. An adhesive layer formed of a second polymeric material has a first surface that is attached to a second side of the film substrate.