| 摘要 |
<p>A method for the fabrication of a high light luminosity LED-light source with at least two LED-dice requires initially coating the circuit board , with the exception of the contact areas, with an insulating layer, and then either contact 'bumps' or contact layers are placed on one surface, or contact layers with a thickness of 1-50 mu m are placed on the contact areas of the circuit board. The LED dice are pressed and simultaneously or subsequently soldered by ultrasound and/or thermally, using the flip-chip technology, with the contact areas, from below, on to the contact areas of the circuit board.</p> |
