| 摘要 |
PROBLEM TO BE SOLVED: To prevent heads of bump electrodes from being crushed and damages to semiconductor substrate or element when sealing the exposed bump electrodes formed on a semiconductor substrate with resin. SOLUTION: Bump electrodes 25, each composed of an upper layer tapered upward with narrowing the sectional area and a columnar lower layer, are formed on a semiconductor substrate 9, the upper layers of the bump electrodes are inserted into through-holes 32 of a plate 33, each having a opening smaller than the bottom of the bump electrode upper layer, the entire in this condition is covered with a die 34 and sealed with a resin, and the die 34 and the plate 33 are removed. |
