| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus and a method for wire bonding, capable of dealing with a narrow electrode pitch at a first bonded part and obtaining a sufficient bonding strength at a second bonded part. SOLUTION: The method for wire bonding comprises the steps of forming the first bonded part by an inside capillary 12, having a distal end 12a of a fine diameter, relatively movably providing an outside capillary 14 in the longitudinal axial direction at the outside of the capillary 12, and simultaneously, forming a second bonded part, by using both the capillary 12 and the capillary 14. |
