Wiring substrate, method of manufacturing the same and semiconductor device

摘要

A wiring substrate (10) equipped with a rerouted wiring (17) having one end connected to an electronic-part mounting pad (16) for electrically connecting an electronic part and another end connected to an external-connection terminal (12). In the wiring substrate, a low-elasticity underlayer (3) made of a material having a lower modulus of elasticity than that of a base material (1) of the wiring substrate (10) is disposed between the base material (1) of the wiring substrate and the electronic-part mounting pad (16) and the rerouted wiring (17). A method of manufacturing the wiring substrate and a semiconductor device using the wiring substrate are also disclosed.