Socket for pin grid array package

摘要

A socket is provided for receiving electronic packages having different first and second sizes. The socket comprises a base housing having a top surface including an array of pin receiving chambers as well as base side walls. The socket also comprises a cover having a top surface including an array of holes corresponding to the array of pin receiving chambers. The cover also includes cover side walls that slidably engage the base side walls. Further, the socket comprises first and second locating members provided on at least one of the base housing and cover. The first locating member is positioned to engage and align an electronic package having a first size with the array of holes in the cover, and the second locating member is positioned to engage and align an electronic package of a second size with the array of holes in the cover.