| 摘要 |
PROBLEM TO BE SOLVED: To improve a productivity with no need to install a contact-type thermometer to a semiconductor substrate as a noncontact thermometer or a radiation thermometer capable of measuring a measurement plate installed on a line at the time of calibration, that is, no semiconductor substrate on the line. SOLUTION: The semiconductor manufacturing apparatus comprises the semiconductor substrate, the noncontact thermometer for measuring the semiconductor substrate without contacting the semiconductor substrate capable of moving on the line where the noncontact thermometer can measure, a measurement plate used for mesuring a reference temperature to calibrate the non-contact thermometer, and a contact thermometer for measuring the reference temperature of the measurement plate with contacting with the measurement plate. The measurement plate is arranged in a position farther than the semiconductor substrate on the basis of the noncontact thermometer on the line where the noncontact thermometer can measure. COPYRIGHT: (C)2005,JPO&NCIPI
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