| 摘要 |
PROBLEM TO BE SOLVED: To provide a sealing agent which is excellent in bonding performance to a flexible base material wherein proper flexibility and deforming performance is acquired, and stress centralization is suppressed in the neighborhood of its interface with the flexible base material; and to provide a membrane circuit board which is excellent in long term stability wherein wiring is prevented from being damaged due to a bending stress, and a sealing layer is hardly peeled. SOLUTION: This sealing agent for sealing electronic parts mounted on a flexible base material is configured with epoxy resin as main components by containing thermoplastic polyester resin particles. Also, this membrane circuit board 1 is provided with a flexible base material 11 and electronic parts 12 mounted on the flexible base material 11 wherein the electronic parts 12 are sealed by a sealing layer 15. The sealing layer 15 is configured with the epoxy resin as main components by containing the thermoplastic polyester resin particles. COPYRIGHT: (C)2005,JPO&NCIPI
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