| 摘要 |
PROBLEM TO BE SOLVED: To secure a suitably conductive state by surely connecting substrates to each other without causing troubles such as defective conduction and breakage. SOLUTION: A plurality of bumps 41 are formed on a wiring electrode 21 on the connection end of an FPC substrate 13. A plurality of through holes 42 are formed on positions corresponding to the bumps 41 in an electrode pad 33 on the connection end of a TFT substrate 14. The connection end of the FPC substrate 13 is faced to the connection end of the TFT substrate 14, the bumps 41 are inserted into the through holes 42, and the heads of the bumps 41 are projected to the upper part of the electrode pad 33. Then the heads of the bumps 41 are irradiated with laser beams to melt and solidify the heads. COPYRIGHT: (C)2005,JPO&NCIPI
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