发明名称 |
Deposition of buffer layers on textured metal surfaces |
摘要 |
A method of making a multilayer article includes depositing a first material on the surface of a metal substrate to form a seed layer of the first material, the first material being deposited under reducing conditions relative to the metal substrate, and then epitaxially depositing a second material on a surface of the seed layer, wherein the second material is deposited from a solution-based precursor under second conditions that are more oxidizing than the reducing conditions used in the deposition of the first material.
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申请公布号 |
US7261776(B2) |
申请公布日期 |
2007.08.28 |
申请号 |
US20040812676 |
申请日期 |
2004.03.30 |
申请人 |
AMERICAN SUPERCONDUCTOR CORPORATION |
发明人 |
RUPICH MARTIN W.;SCHOOP URS-DETLEV;VEREBELYI DARREN;KODENKANDATH THOMAS;LI XIAOPING |
分类号 |
C30B29/16;B32B15/18;C30B7/00;C30B23/00;C30B25/00;C30B28/12;C30B28/14;C30B29/22;H01L39/12;H01L39/24 |
主分类号 |
C30B29/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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