发明名称 Deposition of buffer layers on textured metal surfaces
摘要 A method of making a multilayer article includes depositing a first material on the surface of a metal substrate to form a seed layer of the first material, the first material being deposited under reducing conditions relative to the metal substrate, and then epitaxially depositing a second material on a surface of the seed layer, wherein the second material is deposited from a solution-based precursor under second conditions that are more oxidizing than the reducing conditions used in the deposition of the first material.
申请公布号 US7261776(B2) 申请公布日期 2007.08.28
申请号 US20040812676 申请日期 2004.03.30
申请人 AMERICAN SUPERCONDUCTOR CORPORATION 发明人 RUPICH MARTIN W.;SCHOOP URS-DETLEV;VEREBELYI DARREN;KODENKANDATH THOMAS;LI XIAOPING
分类号 C30B29/16;B32B15/18;C30B7/00;C30B23/00;C30B25/00;C30B28/12;C30B28/14;C30B29/22;H01L39/12;H01L39/24 主分类号 C30B29/16
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