| 摘要 |
A package for a micro-electromechanical device includes a substrate adapted to support the micro-electromechanical device. The micro-electromechanical device is electrically coupled to a plurality of electrodes. The package also includes a thermally conductive structure coupled to the substrate, an electrical contact layer having a plurality of traces in electrical communication with the plurality of electrodes, and an interposer structure coupled to the substrate. The interposer structure includes a continuous annular region defining a recessed region bounded by a bond surface. The package further includes a transparent cover coupled to the interposer structure and sealing the micro-electromechanical device in the recessed region to isolate the micro-electromechanical device in a controlled environment. |
