| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board capable of preventing the deterioration of the characteristics of an element formed in a semiconductor board. SOLUTION: The wiring board 10 has the semiconductor board 17 with through-holes 32 and 33 coated with insulating films 18, through-electrodes 21 and 22 formed in the through-holes 32 and 33 and first wirings 26 and 27 connected at one end of the through-electrodes 21 and 22 while being electrically connected to an electronic part 11. The wiring board 10 further has second wirings 28 and 29 connected at the other end of the through-electrodes 21 and 22 while being electrically connected to a mounting board 12. In the wiring board 10, a first conductivity type impurity diffusion layer 35 formed in a conductivity type different from the semiconductor board 17, an element containing the first conductivity type impurity diffusion layer 35 as a component and being electrically connected to the first and second wirings 26 to 29 and first guard rings 24 and 25 surrounding the through-holes 32 and 33 are fitted in the semiconductor board 17. COPYRIGHT: (C)2009,JPO&INPIT
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