发明名称 LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
摘要 A laser processing device and a laser processing method are provided to maintain processing quality by forming conductive films together by changing a processing condition by using a slit with a crystal shape in response to a wiring pattern of the object. A mask(20) has a slit defining the shape of a laser beam irradiated to a substrate(15). An optical system images the laser beam with a predetermined shape on the substrate. A fuel gas supply unit supplies the source gas of a laser chemical vapor deposition method to the substrate. A condition selecting member(21) selects a first condition and a second condition about the laser output and a processing time. The laser output in the second condition is lower than the laser output in the first condition. The processing time in the second condition is longer than the processing time in the first condition.
申请公布号 KR20090040843(A) 申请公布日期 2009.04.27
申请号 KR20080099532 申请日期 2008.10.10
申请人 OMRON CORPORATION 发明人 TSUKAGOSHI MASAYUKI
分类号 H01L21/268 主分类号 H01L21/268
代理机构 代理人
主权项
地址