Wireless bus for intra-chip and inter-chip communication, including embodiments with adaptable links

摘要

Embodiments of the present invention are directed to a scalable wireless bus for intra-chip and inter-chip communication. The scalable wireless bus includes a plurality of wireless-enabled components (WECs). In an embodiment, the scalable wireless bus may have at least one of the number of links among WECs and the capacity of said links adapted based on one or more factors. For example, the number of links and the capacity of the links may be adapted according to one or more of, among other factors, expected activity level over the wireless bus, desired power consumption, delay, and interference levels.

主权项

1. A wireless bus system, comprising:
a plurality of wireless-enabled components (WECs) coupled via a plurality of wireless links; and a controller, coupled to at least one of the plurality of WECs via at least one control link, the controller configured to identify proximally located WECs, configure communications among the plurality of WECs, and adapt the plurality of wireless links; wherein the controller is further configured to obtain a power consumption level of the wireless bus system and adapt the plurality of wireless links according to the power consumption level of the wireless bus system; and wherein the controller is further configured to adapt the plurality of wireless links for the plurality of WECs to utilize a higher number of the plurality of wireless links during a high power consumption level and a lower number of the plurality of wireless links during a low power consumption level.