发明名称 Alignment correction method for substrate to be exposed, and exposure apparatus
摘要 An alignment correction method includes: the step of detecting coordinates of a first observation point 14 and a second observation point 15 set in advance on a substrate to be exposed 1 that is being scanned in a scanning direction A, in order to observe an alignment deviation of the substrate to be exposed 1; the step of computing a correction amount based on a deviation between the detected coordinates and a reference line set in advance according to the first observation point 14 and the second observation point 15; and the step of correcting alignment of a subsequent substrate to be exposed 1 based on the computed correction amount.
申请公布号 US9360776(B2) 申请公布日期 2016.06.07
申请号 US201414168212 申请日期 2014.01.30
申请人 V TECHNOLOGY CO., LTD. 发明人 Nomura Yoshiaki;Arai Toshinari
分类号 G01B11/00;G03B27/32;G03B27/74;G03F9/00;H01L21/68;G03F7/20 主分类号 G01B11/00
代理机构 McDermott, Will & Emery LLP 代理人 McDermott, Will & Emery LLP
主权项 1. An alignment correction method for a substrate to be exposed, which corrects alignment of a subsequent substrate to be exposed based on an alignment deviation of a previously exposed substrate to be exposed, in a process of exposing successively substrates to be exposed that are being scanned in a scanning direction by a scanning device, the method comprising the steps of: detecting coordinates of a first observation point and a second observation point set in advance on a substrate to be exposed that is being scanned in the scanning direction, so as to observe an alignment deviation of the substrate to be exposed; computing a correction amount based on a deviation between the detected coordinates and a reference line set in advance according to the first observation point and the second observation point; and correcting alignment of a subsequent substrate to be exposed based on the computed correction amount.
地址 Yokohama-shi JP