CHIP BONDING APPARATUS AND CHIP BONDING METHOD

摘要

Provided are a chip bonding apparatus and a chip bonding method. According to one embodiment of the present invention, the chip bonding apparatus includes: a heating means heating an anisotropic conductive film at a first temperature; an attaching means attaching an integrated circuit chip to the anisotropic conductive film; a stage on which a substrate is settled; a chip transfer means transferring the integrated circuit chip attached to the anisotropic conductive film to be aligned on the substrate; and a bonding head disposed in an upper part of the stage and bonding the integrated circuit chip attached to the anisotropic conductive film on the substrate by thermally compressing the same at a second temperature lower than the first temperature.