| 摘要 |
A device (602) for use in a sputter system(600), comprising at least a first end block (631) and a second end block (632)positioned at opposite sides of the sputter system. The device is adapted such that a target assembly comprising at least one target tube or sputter magnetron, when mounted on the first and second end blocks (631, 632), may be powered actively with RF power at both sides of the assembly, and such that the target assembly, when mounted, is not actively powered continuously with RF power simultaneously at both extremities of a target tube or sputter magnetron. An assembly (601) comprising said device and a control unit for controlling powering of opposite sides of the target assembly by RF power such that the target assembly, when mounted, is not actively powered continuously with RF power simultaneously at both extremities of a target tube or sputter magnetron is also provided, as well as a method for applying RF power to impedance target assembly. |
