CONDUCTIVE PASTE, CONNECTION STRUCTURE AND METHOD FOR PRODUCING CONNECTION STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a conductive paste that allows solder particles to be disposed between electrodes efficiently and can improve conduction reliability between the electrodes.SOLUTION: A conductive paste according to the present invention comprises a thermosetting component, and a plurality of solder particles. When an average particle diameter of the solder particles is T μm, the solder particles comprise solder particles of 0.2 T or less in particle size of 10% or more and 30% or less on a number basis.SELECTED DRAWING: Figure 1