SEMICONDUCTOR DEVICE AND SOLID STATE IMAGE PICKUP DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device which can achieve downsizing.SOLUTION: A semiconductor device according to an embodiment comprises: an internal circuit region provided on a semiconductor substrate; and input/output cell region provided around the internal circuit region. The input/output cell region comprises: a pad formed on a first surface if the semiconductor substrate; a wiring layer which is formed on a second surface of the semiconductor substrate opposite to the first surface and has an interconnection electrically connected to the internal circuit region; a metallic through electrode which pierces the semiconductor substrate immediately above the pad to electrically connect the pad and the interconnection of the wiring layer; and input/output terminals formed on the second surface of the semiconductor substrate immediately above the pad.SELECTED DRAWING: Figure 4