| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique where the adhesive properties between a surface-treated copper foil and a resin base material upon formation a laminate sheet is maintained, and further, the electric properties of the surface-treated copper foil is secured.SOLUTION: Provided that the average value of the maximum sizes of plated particles included in a roughened copper plating layer is defined as M, and after surface-treated copper foil is pasted on a resin base material in such a manner that the roughened copper plating layer is confronted against the resin base material, when the surface-treated copper foil is removed from the resin base material, provided that the average value of the sizes in the same face as the surface of the resin base material of recessed parts formed by pressing the plated particles against the resin base material is defined as B, the B/M satisfies 0.7 or lower.SELECTED DRAWING: Figure 1 |
