Methods to form and to dismantle hermetically sealed chambers

摘要

Embodiments generally relate to methods for forming and dismantling a hermetically sealed chamber. In one embodiment, the method comprises using room temperature laser bonding to create a hermetic seal between a first element and a second element to form a chamber. A bond interface of the hermetic seal is configured to allow the hermetic seal to be opened under controlled conditions using a release technique. In one embodiment, the chamber is formed within a microfluidic chip and the chamber is configured to hold a fluid. In one embodiment a chip comprises a first hermetic seal bonding first and second elements to create a first chamber and a second hermetic seal bonding third and fourth elements to create a second chamber encompassing the first chamber. The first hermetic seal may be broken open independently of the second hermetic seal by the application of a mechanical or thermal technique.

主权项

1. A method for forming a hermetically sealed chamber, the method comprising:
using room temperature laser bonding to create a hermetic seal between a first element and a second element to form the chamber; wherein a bond interface of the hermetic seal is configured to allow the hermetic seal to be broken open under controlled conditions using a release technique; wherein the chamber is formed within is a microfluidic chip comprising a via connected to the chamber; and wherein the chamber is configured to hold a fluid.