| 摘要 |
PURPOSE: To heighten the adhesion between a heat sink and resin and radiating characteristic by providing a junction layer on a mounting surface of a semiconductor element and by being interposed between the semiconductor element and the heat sink and in the shape of fitting in the range of a mounting surface of the semiconductor element. CONSTITUTION: A junction layer 22 is provided on a mounting surface 16 of a heat sink 10 and a semiconductor element 20 is mounted on the heat sink 10 through this junction layer 22. The junction layer 22 is excellent in the heat transfer properties and electric conductivity and, for example, silver, gold and platinum can be mentioned. The semiconductor element 20 can be electrically connected from a mounting surface 24 on the side whereon the junction layer 22 is to be mounted. Further, a length (1) of the junction layer 22 becomes smaller than the length L of the mounting surface 24 of the semiconductor element 20 for being shaped to fit the junction layer 22 to the range of the mounting surface. Thereby, since a resin package 40 does not come in contact with the junction layer 22 thus to allow complete resin sealing and sure conduction between the mounting surface 24 of the semiconductor element 20 and the junction layer 22. |
