Tape-mounted electronic components assembly

摘要

An electronic components assembly, in which electronic components provided with a lead terminal are taped so that they can be automatically inserted in a circuit substrate of an electronic instrument, is disclosed. A plurality of electronic components are mounted on a support tape at regular intervals by fixing said lead terminal onto said support tape. Since said support tape comprises a synthetic resin tape and said tape is formed of a thermoplastic synthetic resin containing inorganic fillers, said synthetic resin tape is superior in dimensional accuracy, tensile strength and heat-resistance and the high-speed taping and automatic insertion of electronic components are achieved. Where said support tape is formed of said synthetic resin tape together with an adhesive tape, said synthetic resin tape is subjected to surface treatments to improve the adhesion of said adhesive tape.