| 摘要 |
PURPOSE:To classify bad modes for the purpose of quality control and to grasp distribution and frequency of their occurrence by a method wherein a defective chip is painted during the inspection of a wafer for various characteristic tests. CONSTITUTION:A signal indicating a bad mode for a wafer 10,to be inspected, which has been judged by a judgement unit 3 and another signal, from a control unit 5, which detects a defective chip according to each characteristic test are input to a color-selecting unit 4; as a result, color-selecting signals a, b, c corresponding to each bad mode are input to a painting drive unit 6a of an inker unit 6. The inker unit 6 paints a color corresponding to the bad mode on a chip of the wafer 10, to be inspected, mounted on a chuck top 11 by means of a probe card 8 attached to a head plate 7, a probe-card needle 9 and the color-selecting signals a, b, c fed to the painting drive unit 6a. By this method, it is possible to easily classify bad modes with the eye.
|
