| 摘要 |
PURPOSE:To prevent the yield of resin cracks and to make a device thin, by using a temporary intermediate indirect material on the surface of a lead frame, mounting an element, bonding the element and the frame with a bonding resin, and sealing the device with a sealing resin. CONSTITUTION:A piece of heat resisting adhesive tape 5 is attached to the surface of a lead frame. A bonding resin 3 is applied on an element mounting part 5a. Thereafter, an element 1 is mounted. When vertical external force is applied on the element 1, the resin 3 is pushed to the outer part of te element 1 and attached to the side surface of the frame 2. After the resin 3 is hardened, the tape 5 is removed, and ultrasonic bonding is performed. At this time, since temperature is low, the resin 3 an sufficiently withstand the temperature. Thereafter, the surrounding part of the device is sealed with a sealing resin 4 and molded. Sine there is no place where the stress is concentrated in the sealing resin at high temperature during reflow, cracks are not yielded in the resin. Furthermore, the device can be made thin. |
