A needle centre to check the dimensions of semiconductor chips on a wafer and withput bond connecting wires consists of six radial insulated measuring needles (2a-2f), made of W which can be entirely or partly Au plated. They are fixed between the conical surface of a cone (1) and a conical ring (4) and are embedded in an insulating adhesive (1). The latter has an epoxy resin basis. The cone should be made of a metal with the same temp. coefft. as the ring and the needles. The ring is made of anodised Al.
