发明名称 LAMINATED STRUCTURE OF BUS BAR AND INSULATING PLATE CONTAINED IN ELECTRIC CONNECTION CASE
摘要 <p>PURPOSE: To achieve cost reduction by decreasing the number of insulating plates. CONSTITUTION: The lower surface of a bus bar 4, which is arranged at the lower surface of an insulating plate 16 at the upper layer, and the upper layer of a bus bar 5, which is arranged at the upper surface of an insulating plate 17 at the lower layer, are made to face each other at a constant interval T. At the same time, at the lower surface of the upper-layer insulating plate 16 and the upper surface of the lower insulating plate 17, protruding parts 16b, 17a, and 17b for holding the gaps in contact with the facing surfaces of the bus bars 4 and 5 protruding in the facing directions are formed.</p>
申请公布号 JPH08322127(A) 申请公布日期 1996.12.03
申请号 JP19950124001 申请日期 1995.05.23
申请人 SUMITOMO WIRING SYST LTD 发明人 KOBAYASHI SEIJITSU
分类号 H01R13/46;H02G3/16;H02G5/00;H05K1/00;H05K1/02;H05K3/10;H05K3/20;H05K3/46;(IPC1-7):H02G3/16 主分类号 H01R13/46
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