| 摘要 |
A support for electronic components comprises a substrate 11 which is provided with an electrically isolating coating layer by applying a first ceramic layer 12 by a thermal spraying process. Voids 13 in the first ceramic layer are sealed by applying a fine dispersion of a filler material, and heat treating to consolidate the sealed isolating layer 12, 14. The dispersion may comprise a fine dispersion of a polymeric material or a precursor therefor ; a ceramic ; a glass ; or precursor for a ceramic or a glass. The substrate may be a metal matrix composite, eg a matrix of aluminium or aluminium alloy reinforced with particulate silicon carbide. The ceramic of the first layer may be alumina, mullite, cordierite or firconia. The ceramic derived from a precursor is preferably alumina, the precursor therefor being boehmite. |
