| 摘要 |
<p>PROBLEM TO BE SOLVED: To maintain grounded potential of high frequency band in a wide range and to obtain high performance characteristics by forming a solder bump at the rear side of a multilayer substrate of a antenna multilayer to maintain a fixed interval from a grounded surface of a mounted substrate. SOLUTION: The solder bumps 550, 551, 552 and 553 are formed at the rear side of a resonator of the mulytilayer substrate 500. Since the bumps 550, 551, 552 and 553 are capable of being set to necessary positions optionally, the grounded potential of the high frequency band is maintained in a wide range and the high performance characteristics of the resonator is result obtained. Consequenty, a transmitting filter, a breaching filter circuit and a receiving filter are adaptable to a strip line resonator or an LC resonator consisting of an air-core coil and a chip capacitor similarly as the transmitting filter or the solder bumps are also adaptable to the antenna multicoupler of the multilayer substrate formed by a surface acoustic wave resonator type SAW filter. In this case, the miniaturization, cost reduction and performance improvement of the antenna multicoupler is also enabled.</p> |
