| 摘要 |
PURPOSE: To prevent the sticking of solder paste on the surface of a plate part member and exclude incorrect metering, by heating the plate part member and forming solder balls in recessed parts after a plurality of the recessed parts of the plate part member are filled with the solder paste, the solder paste left on the surface of the plate part member is scraped off by using a hard knife edge, and metering is performed. CONSTITUTION: A squeegee 18 is slided along the surface of a plate part member 10 having a plurality of recessed parts 12, which are filled with solder paste supplied on the surface. A hard knife edge 22 forming an obtuse angle to the plate part member in the sliding direction is slided along the surface of the plate part member. The solder paste left on the plate part member is scraped off, and accurate metering is performed. By heating the plate part member 10, solder particles contained in the solder paste 14 in the recessed parts 12 are fused, and solder balls 20 are formed by the effect of surface tension. Electrode pads 24 of a semiconductor chip 22 are made to abut against the solder balls 20, which are transferred to the electrode pads 24 from the plate part member 10. |
