| 摘要 |
PURPOSE: To obtain a small-sized lightweight semiconductor device, by fixing an insulating sheet having a metal layer to a passivation film, connecting the metal layer with the electrode of a semiconductor chip via a hole, forming a specified wiring pattern, which is joined to outer connection terminals, and forming insulating coat on the insulating sheet. CONSTITUTION: An insulating sheet 38 on one surface of which a metal layer 40 is stuck is fixed on a semiconductor chip 32 on which a passivation film 34 is formed. In the part position of the metal layer 40 which part position corresponds to an electrode 36 of the semiconductor chip 32, a hole is made. In the insulating sheet 38 of the part position corresponding to the hole of the metal layer 40, a hole is made. Thereby the electrode 36 of the semiconductor chip 32 is exposed. The electrode 36 of the semiconductor chip 32 is electrically connected with the metal layer 40 via the formed holes. An necessary wiring pattern is formed in the metal layer 40, outer connection terminal junction part 43 is exposed, an insulating coat 42 is formed on the insulating sheet 38, and an outer connection terminal 46 is joined to the exposed outer connection terminal junction part 43. |
