| 摘要 |
PURPOSE: To maintain the reliability of a resin-encapsulated semiconductor device, to improve the electrical characteristic of the device, to reduce the thickness and size of the device itself, and at the same time, to mount a large-area semiconductor chip on the device. CONSTITUTION: A semiconductor device is composed of a rectangular semiconductor chip 1, a plurality of inner leads 11, a plurality of outer leads 12, a plurality of metallic thin wires 3, and a sealing resin 4. The chip 1 is provided with a plurality of electrode terminals 6 arranged on the main surface of the chip 1 roughly along the center line of the main surface. The leads 11 are divided into two groups for the facing two sides of the chip 1 and extended to the vicinities of the terminal 6 from both sides of the chip 1 by maintaining a prescribed interval between the main surface 1a of the chip 1 and the leads 11. The outer leads 12 are connected to their corresponding inner leads 11 and bent toward the chip 1 at the connecting sections with the leads 11 at nearly right angles. Both ends of the thin wires 3 are respective connected the electrode terminals 6 and front ends of the inner leads 11. The chip 1, inner leads 11, and thin wires 3 are encapsulated with resin 4, and the outer leads 12 are led out from the resin 4. |
