| 摘要 |
PROBLEM TO BE SOLVED: To provide a BGA package board which can constitute a thin and lightweight BGA package, such that no crack is generated in a solder ball at the time of cycle test and such that a fine pitch can be realized. SOLUTION: A conductor pattern 3 is formed on a solder resist layer 2 made of polyimide, and a cover film 4 is formed on the conductor pattern 3. The conductor pattern 3 has a motherboard connection land 3a and an IC connection bonding pad 3b. An aperture 5 of the solder resist layer 2 is formed to cover a peripheral portion of the land 3a, and the shape of an end portion of the aperture 5 is tapered. A solder ball 6 is formed on the land 3a. |
