发明名称 HIGH FREQUENCY LAMINATED CHIP PART AND METHOD OF MANUFACTURING THE SAME
摘要 PURPOSE: A high frequency laminated chip part and method of manufacturing the same is provided to cancel inductance by adjusting internal electrode pattern by which a current flow in the electrode is bent in a certain angle. CONSTITUTION: A number of device sheets(701) are prepared by using a slurry of a certain composition. First internal electrode pattern(702) is printed in the shape of S on the sheet so that a current flow is bent into reverse direction. Second internal electrode pattern(704) is printed in the opposite direction of the first pattern(702). At lease two device sheets(701) are stacked to form a laminate so that current flows are directed oppositely in internal electrodes(708,709) of adjacent upper and lower layers. The laminate is heat treated for aging. External electrodes(710) are formed on both ends of the laminate to be alternately connected to the internal electrodes(708,709).
申请公布号 KR20010008321(A) 申请公布日期 2001.02.05
申请号 KR20000069924 申请日期 2000.11.23
申请人 INNOCHIPS TECHNOLOGY 发明人 EOM, U SIK;KIM, DEOK HUI;PARK, IN GIL
分类号 H01G4/30 主分类号 H01G4/30
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