Edgebanding process and apparatus

摘要

This invention relates to a process for applying an edgeband (130) to a planar edge (102) and an apparatus (100) for performing the process. In the process, one or more gluing edge(s) of the structure (102) and/or edgeband (130) is/are heated to a temperature of greater than 25 DEG C, a heated reactive adhesive is then applied to the gluing edge(s), the structure (102) and edgeband (130) are then brought together to form a composite structure, with the reactive adhesive forming the bond. In the apparatus (100), the reactive adhesive is provided from a sealed adhesive system (108).