| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a smaller and thinner semiconductor relay where a distance between a light-emitting element and a photoelectromotive force element is more precise. SOLUTION: An LED3 is die-bonded to the bottom surface of a recessed part 2 of a circuit board 1 bearing a wiring patterned to a specified form while a photoelectromotive force element 5 is flip-chip-mounted on the wiring pattern of the circuit board 1 through a bump 6 so as to face the LED3 and also to cover the opening part of the recessed part 2 of the circuit board 1. Thus, dimension precision in distance between the LED3 and the photoelectromotive force element 5 is improved. Since the LED3, the photoelectromotive force element 5 and an MOSFET7 are provided on a single circuit board 1 while the photoelectromotive force element 5 is flip-chip-mounted, the semiconductor relay is smaller and thinner.</p> |
