摘要 |
A process of forming a mandrel (1, 2, 4, 5; 7, 8, 9, 11, 12) for manufacturing inkjet orifice plates (6, 13) and the like includes the steps of providing an electrically-conductive layer (2, 8) on a substrate (1, 7), providing a pattern of electrically conductive surfaces (4a, 11a) on the conductive layer (2, 8), and surface treating the pattern of conductive surfaces (4a, 11a) to reduce adhesion of a subsequently applied electroplated film (6, 13) to the pattern of conductive surfaces (4a, 11a). The mandrel (1, 2, 4, 5; 7, 8, 9, 11, 12) includes a substrate (1, 7), a pattern of electrically conductive surfaces (4a, 11a) on the substrate (1, 7) and an oxide layer (5, 12) on the pattern of conductive surfaces (4a, 11a) for reducing adhesion of an electroplated film (6, 13) to the pattern of conductive surfaces (4a, 11a). The pattern of conductive surfaces (4a, 11a) can be an electro-deposited layer of nickel, and the release means (5, 12) can be a nickel oxide and/or nickel hydroxide film on the layer of nickel. <IMAGE> |
申请人 |
HEWLETT-PACKARD CO., PALO ALTO, CALIF., US |
发明人 |
LAM, SI-TY, PLEASANTON, CA 94566, US |