发明名称 Semiconductor device having PN junction diode and method for manufacturing the same
摘要 A semiconductor device includes: a semiconductor support substrate having a first conductive type; an insulation layer on the substrate; a semiconductor layer on the insulation layer; a semiconductor element in the semiconductor layer; and a first impurity diffusion region having a second conductive type. The first impurity diffusion region in the substrate contacts the insulation layer, and is isolated from the semiconductor layer with the insulation layer. The first impurity diffusion region and the substrate provide a PN junction diode. The semiconductor element has a maximum operation voltage, and the PN junction diode has an applied voltage opposite to a forward voltage and lower than the maximum operation voltage.
申请公布号 US2007096174(A1) 申请公布日期 2007.05.03
申请号 US20060589205 申请日期 2006.10.30
申请人 DENSO CORPORATION 发明人 HIGUCHI YASUSHI
分类号 H01L29/76 主分类号 H01L29/76
代理机构 代理人
主权项
地址