LIGHT EMITTING DIODE FOR MOUNTING TO A HEAT SINK

摘要

A light emitting diode (LED) apparatus for mounting to a heat sink 140, 166, 270 having a front surface 144, 170, 274 with an opening 142, 168, 272 therein is disclosed. The apparatus includes a sub-mount 102, at least one LED die 104, 244 mounted on the sub-mount, and a thermally conductive slug 106 having first 108 and second 1 10 areas. The first area is thermally coupled to the sub-mount and the second area has a post 1 12, 162, 250 protruding outwardly therefrom. The post is operably configured to be received in the opening in the heat sink and to secure the LED apparatus to the heat sink such that the second area is thermally coupled to the front surface of the heat sink. Other embodiments for mounting an LED apparatus utilizing adhesive thermally conductive material 196, spring clips, insertion snaps, or welding are also disclosed.