An electrical device includes a circuit board having one or more electrical components mounted to the circuit board. At least a portion of the circuit board is encapsulated in a thermoplastic polymer material to encapsulate the electrical components. The device may be fabricated by at least partially shielding the electrical components with polymer material, followed by overmolding the polymer material with thermoplastic polymer material. The shielding material may comprise a pre-formed component, or it may comprise thermoplastic polymer material that is molded around the electrical components in a first molding step or "shot".
申请公布号
WO2009076579(A2)
申请公布日期
2009.06.18
申请号
WO2008US86521
申请日期
2008.12.12
申请人
INNOTEC CORPORATION;VEENSTRA, THOMAS J.;MULDER, JASON R.;FLEISCHMANN, ERIC L.
发明人
VEENSTRA, THOMAS J.;MULDER, JASON R.;FLEISCHMANN, ERIC L.