Direct/laminate hybrid encapsulation and method of hybrid encapsulation

摘要

An encapsulated device achieves good water vapor transmission rates while reducing the amount of time needed in an inert environment, and thereby reducing the size of the deposition tool used to encapsulate the device. The encapsulated device includes a first barrier layer deposited directly on the device, and a first adhesive and first laminate on the first barrier layer. The laminate comprises a polymeric substrate and a second barrier layer on the substrate. The first barrier layer has a water vapor transmission rate suitable to allow lamination of the laminate on the first barrier layer in a non-inert environment. A method of making an encapsulated device comprises depositing a first barrier layer on the device in an inert environment, applying an adhesive on the first barrier layer in a non-inert environment, and applying a first laminate on the first adhesive in the non-inert environment.

主权项

1. A method of making an encapsulated device, the method comprising:
depositing a first barrier layer on the device in an inert environment, the first barrier layer comprising a first barrier material; forming a first laminate comprising forming a second barrier layer on a polymeric substrate, the second barrier layer comprising a second barrier material; applying an adhesive on the first barrier layer in a non-inert environment; and applying the laminate on the adhesive in the non-inert environment.