Semiconductor device and electronic apparatus

摘要

A semiconductor device that is connected to a wiring substrate includes a semiconductor substrate, a circuit provided on the semiconductor substrate, a connection terminal, and a guard ring that is provided on a peripheral region. In the semiconductor device, the guard ring includes a plurality of wiring layers, and a wiring layer included in the guard ring, which is the farthest from the semiconductor substrate, corresponds to a wiring layer closer to the semiconductor substrate relative to a wiring layer of the connection terminal.

主权项

1. A semiconductor device that is connected to a wiring substrate comprising:
a semiconductor substrate having an outer edge; a circuit provided on a circuit formation region of the semiconductor substrate; a connection terminal that is connected to a conductive pattern included in the wiring substrate and is provided on the circuit formation region; and a guard ring that includes a plurality of wiring layers and is provided on a peripheral region which is a region between the circuit formation region and the outer edge, wherein the guard ring is provided on a connection region, which overlaps with the wiring substrate, and in the connection region, a first wiring layer of the plurality of wiring layers of the guard ring, which is the farthest from the semiconductor substrate, corresponds to a wiring layer closer to the semiconductor substrate relative to a second wiring layer of the connection terminal, the second wiring layer of the connection terminal being farther from the semiconductor substrate than a first wiring layer of the connection terminal.