MEMS devices and fabrication methods thereof

摘要

A method for fabricating a MEMS device includes providing a micro-electro-mechanical system (MEMS) substrate having a sacrificial layer on a first side, providing a carrier including a plurality of cavities, bonding the first side of the MEMS substrate on the carrier, forming a first bonding material layer on a second side of the MEMS substrate, applying a sacrificial layer removal process to the MEMS substrate, providing a semiconductor substrate including a second bonding material layer and bonding the semiconductor substrate on the second side of the MEMS substrate.

主权项

1. A method comprising:
providing a micro-electro-mechanical system (MEMS) substrate having:
a shielding layer coupled to ground;a plurality of vias coupled to the shielding layer; anda first dielectric layer on a first side of the MEMS substrate; providing a carrier including a plurality of cavities; bonding the first side of the MEMS substrate on the carrier, wherein a first portion of the MEMS substrate is in direct contact with a first portion of the carrier; a second portion of the MEMS substrate is in direct contact with a second portion of the carrier; the first portion of the carrier and the second portion of the carrier are separated by a cavity; and the shielding layer fully covers a contacting surface of the first portion of the carrier and a contacting surface of the second portion of the carrier; forming a first bonding material layer on a second side of the MEMS substrate; applying a sacrificial layer removal process to the MEMS substrate; providing a semiconductor substrate including a second bonding material layer; and bonding the semiconductor substrate on the second side of the MEMS substrate.