| 摘要 |
1,175,780. Semi-conductor devices. SIEMENS A.G. 23 Aug., 1968 [24 Aug., 1967], No. 40406/68. Heading H1K. A housing and cooling device G for a semiconductor component H are formed in one piece from a synthetic resin which is a good conductor of heat, such as a polyester resin, Araldite (Registered Trade Mark), an epoxy resin, a silicone, or polypropylene, with, to improve the thermal conductivity, a high loading content of quartz, aluminium oxide, beryllium oxide or metal particles. The cooling device comprises either fins K, or a channel or groove for a liquid or gaseous cooling agent, Fig. 2, not shown. The housing and cooling device are manufactured in a single operation by injection moulding. The semi-conductor component and its connecting leads a may be coated with an insulating material such as varnish, glass or enamel if the housing is a poor insulator. |
