| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique which can prevent a spherical electrode from being deformed in an electric functional test which is made after the assembling operation of a semiconductor device has been finished. SOLUTION: A plurality of interconnection derivation parts 10, for testing, which make a continuity with a plurality of terminal electrodes 5 of a semiconductor element 3 and which can be cut off are formed at the outer circumference of a support base plate 2. When an electric functional test is made, the interconnection derivation parts 10 for testing are used as probe terminals, or they are used as contact terminals at a socket. Thereby, it is not required to bring the measuring terminal of a testing apparatus into contact with spherical electrodes 8. Even when a comparatively soft conductive material such as a solder bump is used as the spherical electrodes 8, it is possible to prevent the spherical electrodes 8 from being deformed in the electric functional test which is made after the assembling operation of a semiconductor device has been finished. Consequently, the spherical electrodes 8 are brought surely into contact with interconnections on a wiring board in a mounting operation. As a result, a connection defect is not generated in a soldering process in the mounting operation, and the connection reliability of the semiconductor device is enhanced. |
