| 摘要 |
PROBLEM TO BE SOLVED: To improve the degree of freedoms of wirings and to prevent the deformation of a routed lead by forming the routed lead in a sealing resin, and further forming a support lead for supporting the routed lead. SOLUTION: A chip select lead 12-2 is so formed to be extended that inner leads 12b-2 become substantially parallel along the side edge 11a of a semiconductor chip to form a routed lead 18. Thus, the degree of freedoms of routing wirings in sealing resin 13 can be improved. A support lead 19 is provided, and the lead 18 is supported by the lead 19. Therefore, even if the long lead 18 is extended, the mechanical strength of the lead 18 can be improved, and the deformation of the lead 18 in a resin molding step can be prevented. |
